IPC J-STD-005:1995
Requirements for Soldering Pastes, Includes Amendment 1 (2007)
Association Connecting Electronics Industries , 01/01/1995
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Lists general requirements for characterization and test of metal content, viscosity, slump, solder ball, tack and wetting of solder pastes. (This is a quality control document and is not intended to relate directly to a material's performance in the manufacturing process). Supersedes QQ-S-571.
Product Information
Published:
01/01/1995
Pages:
38
File Size:
1 file , 320 KB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
