IPC 2294:2024
Design Standard for Printed Electronics on Rigid Substrates
Association Connecting Electronics Industries , 06/01/2024
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IPC 2294:2024 PDF
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates as applies to this standard are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive or nonconductive.
Product Information
Published:
06/01/2024
Pages:
52
ISBN:
9781638161752
File Size:
1 file , 2.5 MB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
