IPC 7092A-2022
Design and Assembly Process Implementation for Embedded Components
Association Connecting Electronics Industries , 10/01/2022
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IPC 7092A PDF
This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.
Product Information
Published:
10/01/2022
Pages:
124
ISBN:
9781638160946
File Size:
1 file , 8.2 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus
