IEC 60191-6-12 Ed. 1.0 en:2002
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
International Electrotechnical Commission , 06/14/2002
$50.00
$100.00
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
Product Information
Published:
06/14/2002
Pages:
20
File Size:
1 file , 490 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
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