IEC 60191-6-12 Ed. 2.0 b:2011
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)
International Electrotechnical Commission , 06/08/2011
$73.00
$145.00
IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition:
- scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title;
- ball pitch of 0,3 mm has been added;
- datum is changed from the body datum to the ball datum;
- combination lists of D, E, MD, and ME have been revised.
- scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title;
- ball pitch of 0,3 mm has been added;
- datum is changed from the body datum to the ball datum;
- combination lists of D, E, MD, and ME have been revised.
Product Information
Published:
06/08/2011
Pages:
37
File Size:
1 file , 510 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
Related Documents
IEC 62733 Ed. 1.0 b:2015
$165.00
IEC 62333-3 Ed. 1.0 b:2010
$26.00
IEC 60748-4-3 Ed. 1.0 en:2006
$139.00
