IPC 2231A:2021
DFX Guidelines
Association Connecting Electronics Industries , 08/01/2021
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This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.
Product Information
Published:
08/01/2021
Pages:
60
File Size:
1 file , 1.9 MB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
