IEC 62769-4 Ed. 3.0 b:2023
Field Device Integration (FDI) - Part 4: FDI Packages
International Electrotechnical Commission , 04/01/2023
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This part of IEC 62769 specifies the FDI®1 Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.
Product Information
Published:
04/01/2023
Pages:
186
ISBN:
9782832267943
File Size:
1 file , 3 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 62769-4 Ed. 3.0 b:2023
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IEC 62769-4 Ed. 1.0 b:2015
$196.00
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