IEC 62769-4 Ed. 1.0 b:2015
Field Device Integration (FDI) - Part 4: FDI Packages
International Electrotechnical Commission , 05/12/2015
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IEC 62769-4:2015 specifies the FDI Packages. The overall FDI architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.
Product Information
Published:
05/12/2015
Pages:
167
File Size:
1 file , 1.2 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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IEC 62769-4 Ed. 1.0 b:2015
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