IEC 61188-5-4 Ed. 1.0 en:2007

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

International Electrotechnical Commission , 10/30/2007

$21.00 $41.00
Provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Product Information

Published: 10/30/2007
Pages: 15
File Size: 1 file , 840 KB
Language: English
Note: This product is unavailable in Ukraine, Russia, Belarus
IEC 61188-5-4 Ed. 1.0 en:2007
IEC 61188-5-4 Ed. 1.0 b:2007

Related Documents

IEC 61784-3-3 Ed. 3.0 b:2016
IEC 60529 Amd.2 Ed. 2.0 b:2013
IEC 60836 Ed. 2.0 b:2005
IEC 61395 Ed. 1.0 b:1998