IEC 61188-5-4 Ed. 1.0 b:2007

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

International Electrotechnical Commission , 10/30/2007

$48.00 $95.00
IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with "J" leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Product Information

Published: 10/30/2007
Pages: 29
File Size: 1 file , 920 KB
Language: English, French
Note: This product is unavailable in Ukraine, Russia, Belarus
IEC 61188-5-4 Ed. 1.0 en:2007
IEC 61188-5-4 Ed. 1.0 b:2007

Related Documents

IEC 80601-2-58 Ed. 2.0 b:2014
IEC 61158-6-2 Ed. 3.0 b:2014
IEC 61196-2 Ed. 2.0 b:1995
IEC 60384-5 Ed. 2.0 b:1993