IEC 60191-6-8 Ed. 1.0 en:2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
International Electrotechnical Commission , 08/27/2001
$31.00
$62.00
Provides the common outline drawings and dimensions for all types of structures and composed material of glass sealed ceramic quad flatpack.
Product Information
Published:
08/27/2001
Pages:
10
File Size:
1 file , 260 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 60191-6-8 Ed. 1.0 b:2001
$26.00
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