IEC 60191-6-8 Ed. 1.0 b:2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
International Electrotechnical Commission , 08/27/2001
$26.00
$51.00
IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
Product Information
Published:
08/27/2001
Pages:
22
File Size:
1 file , 330 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 60191-6-8 Ed. 1.0 b:2001
$26.00
Related Documents
IEC 61158-5-14 Ed. 2.0 b:2010
$182.00
IEC 61158-6-17 Ed. 1.0 b:2007
$209.00
IEC 60384-23 Ed. 1.0 b:2006
$59.00
