IEC 60191-6-4 Ed. 1.0 en:2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
International Electrotechnical Commission , 06/11/2003
$46.00
$92.00
Covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
Product Information
Published:
06/11/2003
Pages:
16
File Size:
1 file , 500 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 60191-6-4 Ed. 1.0 b:2003
$48.00
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