IEC 60191-6-4 Ed. 1.0 b:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

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IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.

Published: 06/11/2003

Pages: 32

File Size: 1 file , 480 KB

Language: English, French

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$48.00

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