IEC 60191-6-3 Ed. 1.0 en:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
International Electrotechnical Commission , 09/29/2000
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Stipulates a method for quad flat packs measuring dimensions which are classified into Form E.
Product Information
Published:
09/29/2000
Pages:
17
File Size:
1 file , 180 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 60191-6-3 Ed. 1.0 b:2000
$73.00
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