IEC 60191-6-3 Ed. 1.0 en:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
International Electrotechnical Commission , 09/29/2000
$52.00
$104.00
Stipulates a method for quad flat packs measuring dimensions which are classified into Form E.
Product Information
Published:
09/29/2000
Pages:
17
File Size:
1 file , 180 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 60191-6-3 Ed. 1.0 b:2000
$73.00
Related Documents
IEC 61076-8-106 Ed. 1.0 b:2023
$139.00
IEC 62934 Ed. 1.0 b:2021
$139.00
IEC 61987-23 Ed. 1.0 b:2015
$48.00
IEC 61523-1 Ed. 1.0 en:2001
$188.00