IEC 60191-6-3 Ed. 1.0 b:2000

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

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IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

Published: 09/29/2000

Pages: 34

File Size: 1 file , 320 KB

Language: English, French

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$73.00