BS PD ES 59008-3:1999
Data requirements for semiconductor die-Mechanical, material and connectivity requirements
BSI Group , 12/15/1999
$80.00
$160.02
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use. To be read in conjunction with PD ES 59008-1Cross References: ES 59008-1*ES 59008-2*ES 59008-4*ES 59008-5*ES 59008-6-1*ES 59008-6-2*IEC 60191 *IEC 61360-1:1995*EIA/JESD30-B*EIA/JEP95*BS 3934*
Product Information
Published:
12/15/1999
Pages:
14
ISBN:
0580357597
File Size:
1 file , 390 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
