Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use. Cross References: ISO 9000*EIA/JESD49*EN 100015-1*ES 59008-1*ES 59008-2*ES 59008-3*ES 59008-4-1 *ES 59008-4-2*ES 59008-4-3*ES 59008-4-4*ES 59008-5-1*ES 59008-5-2*ES 59008-5-3*ES 59008-6-1*ES 59008-6-2*