ASTM F1709-97(2008)

1.1 This specification covers pure titanium sputtering targets used as a raw material in fabricating semiconductor electronic devices.

1.2 This standard sets purity grade levels, physical attributes, analytical methods, and packaging.

1.2.1 The grade designation is a measure of total metallic impurity content. The grade designation does not necessarily indicate suitability for a particular application because factors other than total metallic impurity may influence performance.