This test procedure describes a method for the determination of temperature cycling effects or the temperature dependence of attenuation on optical fibers, cables, cable assemblies, connectors, and/or other passive fiber optic devices. This procedure tests the ability of the component to withstand changes in temperature of the surrounding atmosphere that may be encountered during operation. The simulation of temperature shock testing is covered in FOTP-71 (EIA-455-71), "Procedure to Measure Temperature Shock Effects on Fiber Optic Components."(Footnote 1)

Typical indications of damage resulting from this test are:

A. An excessive temporary or permanent change in optical throughput which exceeds specified limits as defined in the Detail Specification.

B. Broken parts, cracks, blisters in materials or accessories.

C. Inability to mate or unmate, if sample is a connector.

D. Damage to seals or "O" rings, if the sample is a connector or device.

Footnote 1 - This FOTP will appear as a future Addendum to EIA 455.