This specification covers the engineering requirements for electrodeposition of gold and the properties of the deposit.
This plating has been used typically to improve the solderability, electrical conductivity, corrosion resistance, performance, and appearance of electronic and electrical parts, but usage is not limited to such applications.
Product Information
Published:
07/18/2002
File Size:
1 file , 96 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus