IPC WP-009:2009

A Summary of Tin Whisker Research References

Association Connecting Electronics Industries , 03/01/2009

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As most of the world converts to lead-free manufacturing, the concern over tin whiskers as a reliability hazard has grown due to the emergence of pure tin as a dominate component surface finish. A significant amount of research on tin whisker formation and tin whisker mitigating strategies has been performed in both commercial and defense industries. This working paper is a summary of the predominant research on tin whiskers as of September, 2008. 15 pages. Released March 2009.

Product Information

Published: 03/01/2009
Pages: 20
File Size: 1 file , 1.4 MB
Language: English
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