IPC 7091:2017
Design and Assembly Process Implementation of 3D Components
Association Connecting Electronics Industries , 06/01/2017
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The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements?some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the components? substrate structure.
Product Information
Published:
06/01/2017
Pages:
108
File Size:
1 file , 5.3 MB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
