IPC J-STD-033:1999

Provides SMD manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive SMDs. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved with the dry packing process, providing a minimum shelf life capability in sealed dry bags of 12 months from the seal date.