IPC CA-821:1995
General Requirements for Thermally Conductive Adhesives
Association Connecting Electronics Industries , 01/01/1995
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Covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as part of the printed wiring board. It defines dielectric thermally conductive adhesives through a specification of test methods and inspection criteria.
Product Information
Published:
01/01/1995
Pages:
18
File Size:
1 file , 140 KB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
