IPC J-STD-027:2003
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations
Association Connecting Electronics Industries , 02/01/2003
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THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
Product Information
Published:
02/01/2003
Pages:
20
File Size:
1 file , 90 KB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
