IPC 9701B:2022
Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments
Association Connecting Electronics Industries , 02/01/2022
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This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
Product Information
Published:
02/01/2022
Pages:
24
ISBN:
9781638160724
File Size:
1 file , 1 MB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
