IPC 7525B:2011
Stencil Design Guidelines
Association Connecting Electronics Industries , 10/01/2011
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This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.
Product Information
Published:
10/01/2011
Pages:
36
File Size:
1 file , 2.1 MB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
