Establishes requirements for qualification and performance of high frequency (microwave) printed boards. Covers both end product inspection and test of microwave boards for microstrip, stripline, mixed dielectric and multilayer stripline applications. It addresses final finish and surface plating coating requirements, conductors, holes/vias, and frequency of acceptance and quality conformance testing, as well as electrical, mechanical and environmental requirements. Revision B incorporates many new requirements in areas such as selection for procurement, new surface finishes, microvia requirements including hole plating thickness and copper wrap/cap plating of filled holes, laminate cracks and voids, etchback, PTFE resin smear, and thermal stress testing.