IPC 4563:2007
Resin Coated Copper Foil for Printed Boards Guideline
Association Connecting Electronics Industries , 11/01/2007
$51.00
$101.00
This guideline covers the requirements for resin coated copper foil intended for use in the formation of high density interconnect surface microvias for printed boards and printed board assemblies.
Product Information
Published:
11/01/2007
Pages:
19
File Size:
1 file , 270 KB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
