IEC 62878-1 Ed. 1.0 b:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
International Electrotechnical Commission , 10/14/2019
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IEC 62878-1:2019(E) specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
Product Information
Published:
10/14/2019
Pages:
38
File Size:
1 file , 1.6 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 62878-1 Ed. 1.0 en:2019
$73.00
IEC 62878-1 Ed. 1.0 b:2019
$73.00
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