IEC 62137-1-2 Ed. 1.0 en:2007
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
International Electrotechnical Commission , 07/25/2007
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The test method is applicable to leadless surface mounting components and surface mounting connectors to which pull test is not applicable. It is not applicable to multi-lead components and gull-wing leads. The method is designed to test and evaluate the endurance of the solder joint between component terminals and lands on a substrate, by means of a shear type mechanical stress. This test is applicable to evaluate the effects of repeated temperature change on the strength of the solder joints between terminals and lands on a substrate.
Product Information
Published:
07/25/2007
Pages:
17
File Size:
1 file , 290 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 62137-1-2 Ed. 1.0 b:2008
$44.00
IEC 62137-1-2 Ed. 1.0 b:2007
$73.00
