IEC 62137-1-1 Ed. 1.0 b:2008
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
International Electrotechnical Commission , 05/14/2008
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The test method described in IEC 62137-1-1:2007 is applicable to gull-wing lead surface mounting components. The method is designed to test and evaluate the endurance of the solder joint between component leads and lands on a substrate, by means of a pull type mechanical stress. This test is suitable for evaluating the effects of repeated temperature change on the strength of the solder joint between component terminals and lands on a substrate.
Product Information
Published:
05/14/2008
Pages:
30
File Size:
1 file , 1000 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 62137-1-1 Ed. 1.0 b:2008
$39.00
IEC 62137-1-1 Ed. 1.0 b:2007
$48.00
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