IEC 61191-3 Ed. 1.0 b:1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
International Electrotechnical Commission , 08/28/1998
$41.00
$82.00
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
Product Information
Published:
08/28/1998
Pages:
31
File Size:
1 file , 530 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 61191-3 Ed. 2.0 en:2017
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IEC 61191-3 Ed. 2.0 b:2017
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IEC 61191-3 Ed. 1.0 b:1998
$41.00
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