IEC 61190-1-2 Ed. 1.0 b:2002
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
International Electrotechnical Commission , 03/22/2002
$34.00
$67.00
Specifies general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections in electronics assembly. Prescribes a quality control document (not intended to relate directly to the material performance in the manufacturing process).
Product Information
Published:
03/22/2002
Pages:
35
File Size:
1 file , 1.3 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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