IEC 61189-3 Ed. 2.0 en:2007
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
International Electrotechnical Commission , 10/09/2007
$159.00
$317.00
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. The major changes with regard to the previous edition concern the addition of 25 new test methods and the deletion of Annex B.
Product Information
Published:
10/09/2007
Pages:
118
File Size:
1 file , 4.6 MB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 61189-3 Ed. 2.0 b:2007
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IEC 61189-3 Ed. 2.0 en:2007
$159.00
IEC 61189-3 Ed. 1.1 b:2006
$101.00
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