IEC 61189-3-719 Ed. 1.0 b:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
International Electrotechnical Commission , 01/05/2016
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IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
Product Information
Published:
01/05/2016
Pages:
22
File Size:
1 file , 590 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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