IEC 61189-2 Ed. 2.0 en:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

International Electrotechnical Commission , 05/30/2006

$209.00 $417.00
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Product Information

Published: 05/30/2006
Pages: 122
File Size: 1 file , 1.2 MB
Language: English
Note: This product is unavailable in Ukraine, Russia, Belarus
IEC 61189-2 Ed. 2.0 en:2006
IEC 61189-2 Ed. 1.0 b:1997

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