IEC 61189-1 Ed. 1.1 b:2001
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology CONSOLIDATED EDITION
International Electrotechnical Commission , 11/22/2001
$114.00
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This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.
Product Information
Published:
11/22/2001
Pages:
51
File Size:
1 file , 620 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 61189-1 Ed. 1.1 b:2001
$114.00
IEC 61189-1 Ed. 1.0 b:1997
$73.00
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