IEC 60749-20 Ed. 3.0 b:2020
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
International Electrotechnical Commission , 08/01/2020
$117.00
$234.00
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
Product Information
Published:
08/01/2020
Pages:
60
ISBN:
9782832287279
File Size:
1 file , 2.5 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 60749-20 Ed. 3.0 b:2020
$117.00
IEC 60749-20 Ed. 2.0 b:2008
$100.00
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