Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.
Product Information
Published:
01/10/2008
Pages:
72
File Size:
1 file , 1.1 MB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus