IEC 60191-6-6 Ed. 1.0 en:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
International Electrotechnical Commission , 03/22/2001
$37.00
$74.00
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
Product Information
Published:
03/22/2001
Pages:
12
File Size:
1 file , 120 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
IEC 60191-6-6 Ed. 1.0 b:2001
$48.00
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