IEC 60191-6-13 Ed. 1.0 en:2007
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
International Electrotechnical Commission , 06/27/2007
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This part of IEC 60191 gives a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array ("FBGA" hereafter) and Fine-pitch Land Grid Array ("FLGA" hereafter). This standard is intended to establish the outline drawings and dimensions of the open-top-type socket out of the test and burn-in sockets applied to FBGA and FLGA.
Product Information
Published:
06/27/2007
Pages:
15
File Size:
1 file , 250 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
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