IEC 60191-6-10 Ed. 1.0 b:2003
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
International Electrotechnical Commission , 11/19/2003
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IEC 60191-6-10:2003 provides the common outline drawings and dimensions for all types of structures and composed materials of plastic very thin small outline non-lead package (hereinafter called P-VSON).
Product Information
Published:
11/19/2003
Pages:
24
File Size:
1 file , 440 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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