IEC 60191-4 Ed. 3.0 b:2013

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

International Electrotechnical Commission , 10/10/2013

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IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.

Product Information

Published: 10/10/2013
Pages: 48
File Size: 1 file , 430 KB
Language: English, French
Note: This product is unavailable in Ukraine, Russia, Belarus
IEC 60191-4 Ed. 3.1 b:2018
IEC 60191-4 Ed. 3.0 b:2013

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