IEC 60191-4 Ed. 2.2 b:2002
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages CONSOLIDATED EDITION
International Electrotechnical Commission , 10/22/2002
$91.00
$182.00
Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.
Product Information
Published:
10/22/2002
Pages:
43
File Size:
1 file , 610 KB
Language:
English, French
Note:
This product is unavailable in Ukraine, Russia, Belarus
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