BS 3934-5:1997

Mechanical standardization of semiconductor devices-Recommendations applying to tape automated bonding (TAB) of integrated circuits

BSI Group , 09/15/1997

$155.00 $309.88
Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

Product Information

Published: 09/15/1997
Pages: 38
ISBN: 0580278123
File Size: 1 file , 940 KB
Language: English
Note: This product is unavailable in Ukraine, Russia, Belarus
BS 3934-5:1997
BS 3934-5:1997

$155.00

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BS 3934-5:1992

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