TIA TSB-144

Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues, and Challenges

Telecommunications Industry Association , 04/01/2003

$42.00 $84.00

The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products.