SAE AMS3692C
Adhesive Compound, Epoxy Resin High Temperature Application
SAE International , 01/20/2022
$37.00
$74.00
This specification covers a two-component adhesive compound, an epoxy resin base and a hardener, in the form of a paste.
This compound has been used typically for non-structural bonding of metals and thermosetting plastics, to themselves and to each other, and as an adhesive for electrical components and devices operating at not higher than 260 degrees C (500 degrees F), but usage is not limited to such applications.
This compound has been used typically for non-structural bonding of metals and thermosetting plastics, to themselves and to each other, and as an adhesive for electrical components and devices operating at not higher than 260 degrees C (500 degrees F), but usage is not limited to such applications.
Product Information
Published:
01/20/2022
File Size:
1 file , 110 KB
Language:
English
Note:
This product is unavailable in Ukraine, Russia, Belarus
