IPC DD-135:1995
Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
Association Connecting Electronics Industries , 08/01/1995
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This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.
Product Information
Published:
08/01/1995
Pages:
36
File Size:
1 file , 370 KB
Language:
English
Note:
This product is unavailable in Russia, Ukraine, Belarus
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